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Smart Cards Expo New Delhi Sept. 2019

Launched in 1999, SmartCards Expo was acquired by Messe Muenchen India in April 2018 as a part of its international expansion strategy. It is India’s only trade fair focusing on smart card technologies and is organized along with the co-located trade fairs IoT India Expo, e-Security Expo, RFID India Expo, Biometrics India Expo, Digital Payments India Expo and Artificial Intelligence India Expo. From 25th until 27 of September in Hall 9, India Expo Centre, Greater Noida, Delhi NCR, India, More information about the Smartcards Expo Smartware representatives will be present at this exhibition, don’t hesitate to contact us to organize a meeting.

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Smartware at Cards & Payments Middle East 2016

Cards and Payments Middle East 2016 is the region’s largest and most important conference and exhibition. This year, for the first time, Smartware is proud to participate in this event. Come and meet the Smartware’s team on the French Pavilion. May 30-June 1, 2016, Dubai International Convention & Exhibition Center (DICEC), Dubai, UAE. More information about the Cards & Payments expo.

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Smartware at ICMA expo 2016

ICMA, the International Card Manufacturers Association represents nearly 250 compangies in the card industry from around the globe.  The 2016 expo session will be co-located with Smart Card Alliance Payments Summit. Come and visit the Smartware booth. April 4-7, 2016, Loews Royal Pacific – Orlando, Florida, USA. More information about the ICMA expo.

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Introduction of US-PICC2-based products

Smartware today introduced assemblies based on the new US-PICC2 The US-4P_SMB (4 contactless heads) and US-4P4I (4 combi heads) are designed to address all contactless cards whatever is the chip manufacturer or the antenna technology. The multiple functionalities of the US-4P_SMB and the US-4P4I allow the personalization of contactless/combi cards & chip card modules, and also the personalization of RFID inlays while ensuring performance, reliability and flexibility. Read more on the « Solutions for Card and module personalization »

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The evolution of the US-nano based products

Smartware today announced the second generation of USnano-based products. USN1e (1 combi head), USN2e (2 combi heads), and USN3e (3 combi heads) are designed to address all combi card whatever is the chip manufacturer or the antenna technology. US-NANO Box evolution is the desktop version to develop applications. The boosted RF front-end and the FPGA-based combi interface coupled with a powerful CPU are the fastest and reliable solution to personalize all the cards and all the chip card modules. Read more on the « Solutions for Card and module personalization »

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Visit Smartware booth in Hong-Kong, Sao Paulo and Las Vegas

Come and visit us at the French pavilion !         March 19-20, 2014 – Hong-Kong Convention & Exhibition Centre Web site of the event       April 9-11, 2014 – Sao Paulo Transamerica Expo Center Web site of the event       May 13-15, 2014 – Las Vegas The Mirage Web site of the event Contact us to get your free visitor pass and to book a RDV with our team !

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